International Conference on Software Maintenance: Proceedings
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International Conference on Software Maintenance: Proceedings October 17-20, 1995 Opio (Nice), France (International Conference on Software Maintenance) by Iee Computer Society Technical Council on Software Engineering

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Published by Institute of Electrical & Electronics Enginee .
Written in English

Subjects:

  • Software engineering,
  • Software Quality Control,
  • Computers,
  • Computers - General Information,
  • Computer Books: General,
  • Programming - Software Development,
  • Computer Science,
  • Computer Bks - General Information

Book details:

The Physical Object
FormatPaperback
Number of Pages375
ID Numbers
Open LibraryOL9653242M
ISBN 100818671416
ISBN 109780818671418

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UPDATE: Registration for ICSM, the 29th IEEE International Conference on Software Maintenance and co-located events has started! *Early bird registration closes August 2, * Please note that presenting authors should register within August 2, ICSE, the International Conference on Software Engineering,® is the premier software engineering conference, providing a forum for researchers, practitioners and educators to present and discuss the most recent innovations, trends, experiences and concerns in the field of software engineering. Software Maintenance and Evolution scheduled on April , in April in Istanbul is for the researchers, scientists, scholars, engineers, academic, scientific and university practitioners to present research activities that might want to attend events, meetings, seminars, congresses, workshops, summit, and symposiums. ICSME ' Proceedings of the IEEE International Conference on Software Maintenance and Evolution.

SESSION: Maintenance Cited By Jimenez M, Rwemalika R, Papadakis M, Sarro F, Le Traon Y and Harman M The importance of accounting for real-world labelling when predicting software vulnerabilities Proceedings of the 27th ACM Joint Meeting on European Software Engineering Conference and Symposium on the Foundations of Software Engineering. International Conference on Software Maintenance (ICSM) the leading research conference in software maintenance and evolution. Since its start in , ICSM (International Conference on Software Maintenance) has grown and developed into an international forum for software maintenance researchers and practitioners to examine key issues facing the software maintenance community. Niessink, F & van Vliet, H , Two Case Studies in Measuring Software Maintenance Effort. in Proceedings of the International Conference on Software Maintenance, Bethesda, Maryland, USA, November , IEEE, pp. Cited by: The objective of Advances in Engineering Software is to communicate recent and projected advances in computer-based engineering techniques. The fields covered include mechanical, aerospace, civil and environmental engineering, with an emphasis on research and development leading to practical problem-solving.. The journal publishes research papers, survey papers on key application areas, short.

This book constitutes the refereed proceedings of the 12th International Conference on the Quality of Information and Communications Technology, QUATIC , held in Ciudad Real, Spain, in September The 19 full papers and 6 short papers were carefully reviewed and selected from 66 submissions. The SWQD proceedings book is dealing with the complexity and challenges of software engineering and software quality in the cloud, focusing on multi-disciplinary systems, process improvement, knowledge engineering and machine learning, source code analysis and software maintenance and testing. 29th IEEE International Conference on Software Maintenance 22 - 28 September - Eindhoven, The Netherlands. Home | book, conference or workshop. The first part is dedicated to PhD students in the midst of their doctoral studies in the field of software maintenance, who intend to finish their PhD within the next two years ( The SMTA International Conference Proceedings contain the latest and highest quality information and research on electronics assembly and manufacturing including Advanced Packaging Technology, Flux, Solder, Adhesives, Inspection Technologies, Manufacturing Excellence, Substrates/PCB Technology, and .